spectral_galerkin_heat
spectral_galerkin_heat: spectral heat solver for additive manufacturing.
Copyright 2026 Laboratoire de Mécanique des Solides (LMS), École Polytechnique, CNRS UMR 7649, Institut Polytechnique de Paris, Route de Saclay, Palaiseau, 91128, France.
Author: Théo Andrieux, Jules Dichamp, Manas V. Upadhyay
Licensed under the Apache License, Version 2.0 (the “License”); you may not use this file except in compliance with the License. You may obtain a copy of the License at
Unless required by applicable law or agreed to in writing, software distributed under the License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR CONDITIONS OF ANY KIND, either express or implied. See the License for the specific language governing permissions and limitations under the License.
This package provides a fast, spectrally-accurate heat equation solver optimized for additive manufacturing (3D printing) simulations. It supports both CPU and GPU backends and handles complex physical phenomena including phase change and evaporation.
Public API:
Core interfaces:
SimulationContext,LaserPath,LaserStateBackends:
MathBackend,get_backend(),register_backend()Solvers:
HeatSolver,SpectralSolverI/O:
LocalFSIOManager,load_xdmf(),write_structured_fields()Runner:
StandaloneHeatRunner